Name: Dow DOWSIL EG-4100 Kit Dielectric Gel
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL EG-4100 Kit Dielectric Gel

Two-component, room-temperature-curing silicone dielectric gel system designed for precision encapsulation and potting.
Ultra-low modulus and high conformability to minimize mechanical stress on sensitive electronic components during thermal cycling.
Excellent dielectric strength and volume resistivity for reliable electrical insulation in high-voltage applications.
Non-corrosive, halogen-free formulation compliant with RoHS and REACH directives.
Low outgassing and minimal volatile content, suitable for vacuum and hermetic sealing environments.

Typical Applications Of Dow DOWSIL EG-4100 Kit Dielectric Gel

Encapsulation of power electronics modules including IGBTs, MOSFETs, and SiC-based devices.
Potting of LED drivers, EV onboard chargers (OBC), and DC-DC converters.
Thermal and electrical isolation of battery management system (BMS) sensors and control boards.
Dielectric filling for high-reliability aerospace and defense avionics assemblies.

Chemical Type	Two-part addition-cure silicone elastomer
Product Form	Kit: Part A (base) + Part B (catalyst), supplied separately
Appearance	Part A: Translucent, viscous liquid; Part B: Clear to pale yellow liquid
Primary Applications	Electrical insulation, component encapsulation, thermal stress mitigation
Key Features	Low modulus, self-leveling, non-slumping, moisture-cure inhibited
Benefits	Reduces solder joint fatigue, enhances long-term reliability under thermal shock
Curing Mechanism	Platinum-catalyzed hydrosilylation at room temperature
Shelf Life (unopened, 25°C)	12 months from date of manufacture

Get in Touch with ERICW

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E-mail: wangxingqiang@ericwchem.com
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15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China