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High thermal conductivity for efficient heat dissipation in compact electronic assemblies.
Room-temperature curing silicone adhesive with excellent long-term stability under thermal cycling.
Low modulus formulation minimizes stress on sensitive components during thermal expansion.
Electrically insulating to prevent short circuits while maintaining robust thermal performance.
Good adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs.
Thermal interface bonding of power semiconductors (e.g., IGBTs, MOSFETs) to heat sinks.
Attachment of LED modules and drivers in automotive lighting and industrial illumination systems.
Die-attach and component mounting in high-reliability aerospace and defense electronics.
Thermal management of battery modules and power control units in electric vehicles.
| Chemical Type | Room-temperature vulcanizing (RTV) silicone elastomer |
| Product Form | Paste, two-component (Part A + Part B) |
| Appearance | Off-white to light gray viscous paste |
| Primary Applications | Thermal interface material (TIM), structural thermal bonding |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV cure |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enables simplified assembly |
| Cure Mechanism | Condensation cure (acetoxy-type) |
| Storage Stability | 12 months at 25°C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
