High-temperature resistance up to 200 °C continuous service, with excellent thermal stability and low-temperature flexibility down to –65 °C.
Outstanding release liner compatibility and clean debonding performance across silicone-coated and fluorosilicone-release substrates.
Low extractables and minimal silicone migration, supporting use in demanding medical device and electronics assembly applications.
Good die-cutting performance and consistent adhesive transfer resistance on high-speed converting equipment.
Formulated for solvent-based coating processes, offering balanced tack, peel adhesion, and shear holding power.
Medical-grade wearable sensors and diagnostic patches requiring biocompatible, skin-friendly bonding.
High-reliability flexible circuit bonding in automotive electronics and aerospace control systems.
Thermal interface tapes for LED lighting assemblies and power electronics heat dissipation solutions.
Release liner–backed specialty tapes used in semiconductor handling and cleanroom masking applications.
Die-cut gasketing and sealing components for industrial filtration and fluid management systems.
| Chemical Type | Platinum-cured silicone pressure-sensitive adhesive |
| Product Form | Solvent-based liquid (toluene/acetone blend) |
| Appearance | Clear to slightly hazy, low-viscosity liquid |
| Primary Applications | High-performance medical, electronics, and industrial bonding tapes |
| Key Features | High-temp stability, low extractables, clean release, die-cutting robustness |
| Benefits | Reduced outgassing in enclosed assemblies; consistent performance across wide temperature range |
| Curing Mechanism | Heat-activated platinum-catalyzed addition cure |
| Storage Conditions | Store at 15–25 °C in sealed containers; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China