wangxingqiang@ericwchem.com
15921782326
en
Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL Q3-6575 Dielectric Gel A/B Kit

Dow DOWSIL Q3-6575 Dielectric Gel A/B Kit is a two-part silicone-based insulating gel system offering excellent dielectric strength thermal stability and low modulus for potting encapsulation and gap-filling in EV power electronics LED drivers and high-voltage applications. It cures to a soft resilient gel at room temperature or accelerated heat cure with minimal shrinkage and superior long-term reliability.
  • dow dowsil q3 6575 dielectric gel a b kit_aaaee94f
  • dow dowsil q3 6575 dielectric gel a b kit_aaaee94f

Features Of Dow DOWSIL Q3-6575 Dielectric Gel A/B Kit

  1. Two-component, platinum-catalyzed silicone gel system offering ultra-low modulus and exceptional conformability.

  2. Non-corrosive, halogen-free formulation designed for sensitive electronics and high-reliability assemblies.

  3. Excellent dielectric strength (>20 kV/mm) and stable electrical properties over wide temperature range (–50 °C to +200 °C).

  4. Self-healing flow behavior after dispensing ensures void-free encapsulation and stress relief for delicate components.

  5. Low viscosity A/B components enable precise meter-mix-dispense processing with minimal air entrapment.

Typical Applications Of Dow DOWSIL Q3-6575 Dielectric Gel A/B Kit

  1. Thermal interface and dielectric protection for power electronics modules (e.g., IGBTs, SiC inverters).

  2. Encapsulation of high-voltage sensors and battery management system (BMS) circuitry in EV platforms.

  3. Conformal coating and potting of LED drivers and solid-state lighting assemblies requiring long-term insulation integrity.

  4. Dielectric filling for medical imaging equipment PCBs and diagnostic sensor housings where biocompatibility support is critical.

Specifications Of Dow DOWSIL Q3-6575 Dielectric Gel A/B Kit

Chemical TypePlatinum-catalyzed addition-cure silicone gel
Product FormTwo-component kit (Part A and Part B)
Appearance (Mixed)Translucent, viscous liquid
Primary ApplicationsDielectric encapsulation, thermal interface, stress-relief potting
Key FeaturesUltra-low modulus, non-corrosive, self-leveling, void-free cure
BenefitsEnhanced reliability under thermal cycling, reduced mechanical stress on solder joints and wire bonds
Cure SystemAddition cure (no by-products)
Operating Temperature Range–50 °C to +200 °C (continuous)


Products
Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *

Related Adhesive

Dow DOWSIL 3-6751 Thermally Conductive Adhesive
Dow DOWSIL 3-6751 Thermally Conductive Adhesive
Dow DOWSIL 3-4222 Dielectric Gel Kit
Dow DOWSIL 3-4222 Dielectric Gel Kit
Dow DOWSIL SE 9184 Silicone RTV Adhesive
Dow DOWSIL SE 9184 Silicone RTV Adhesive
Latest News & Blog about ERICW