Two-component, room-temperature curing epoxy system with balanced pot life and rapid fixture strength development.
Exceptional adhesion to metals, composites, ceramics, and engineered plastics without aggressive surface pretreatment.
Low viscosity formulation enables excellent gap-filling capability and penetration into porous substrates.
High tensile and shear strength retention across wide temperature range (–40 °C to +120 °C).
Halogen-free, RoHS-compliant chemistry with low volatile organic compound (VOC) emission.
Aerospace component bonding, including sensor mounting and composite-to-metal structural joints.
Electronics encapsulation and die attachment in power modules and LED assemblies.
Automotive powertrain and battery module assembly requiring thermal and vibration resistance.
Industrial machinery repair and wear-resistant coating underlay bonding.
Medical device assembly where biocompatibility-validated adhesives are required for non-implantable equipment.
| Chemical Type | Bisphenol-A based epoxy resin with modified amine hardener |
| Product Form | Two-component liquid system (Resin: Hardener = 100:35 by weight) |
| Appearance | Amber transparent resin; pale yellow translucent hardener |
| Mixed Viscosity (25 °C) | 8,500–10,500 cP |
| Pot Life (25 °C, 100 g batch) | ≈ 60 minutes |
| Full Cure Time (25 °C) | 7 days |
| Tensile Strength (ASTM D638) | ≥ 32 MPa |
| Service Temperature Range | –40 °C to +120 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China