High-performance film adhesive formulated for elevated-temperature bonding of advanced composites.
Excellent out-life stability at ambient temperature, supporting extended handling and layup flexibility.
Consistent tack and drape characteristics ideal for complex contour tooling and automated tape placement.
Low volatile content ensures minimal porosity and high bond integrity in autoclave-cured structures.
Compatible with carbon fiber, fiberglass, and thermoset prepreg systems across aerospace and industrial platforms.
Aerospace primary and secondary structural bonding (e.g., stiffeners, doublers, and honeycomb core attachment).
Engine nacelle and airframe component assembly requiring high thermal resistance and fatigue durability.
Industrial composite tooling and mandrel bonding where dimensional stability under cure is critical.
Rotorcraft and UAV structural assemblies demanding lightweight, high-strength adhesive joints.
| Chemical Type | Modified epoxy-based film adhesive |
| Product Form | Double-sided polyester carrier film (100 µm nominal thickness) |
| Appearance | Uniform tan-colored, flexible film with matte surface finish |
| Primary Applications | Autoclave-cured composite bonding (180°C / 356°F cure cycle) |
| Key Features | Controlled flow, low exotherm, excellent green strength |
| Storage Conditions | -18°C (0°F) or lower; stable for 12 months when unopened and properly stored |
| Out-Life | 10 days at 23°C (73°F) / 50% RH after thawing |
| Processing Temperature Range | 177–182°C (350–360°F) for full cure |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China