Two-component, room-temperature curing epoxy system with balanced strength and flexibility.
Excellent adhesion to metals, composites, ceramics, and thermoset plastics without surface priming.
Low viscosity for easy mixing and gap-filling in precision bonding applications.
Good resistance to thermal cycling, humidity, and non-aggressive chemicals.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Aerospace component assembly, including sensor mounting and composite-to-metal bonding.
Electronics encapsulation and structural bonding of PCBs, housings, and heat sinks.
Automotive powertrain and lighting module assembly requiring vibration-damping adhesion.
Industrial equipment repair and maintenance of pumps, valves, and hydraulic manifolds.
Medical device manufacturing where biocompatibility-adjacent processing stability is critical.
| Chemical Type | Bisphenol-A based epoxy resin with modified amine hardener |
| Product Form | Two-component liquid (Part A: resin, Part B: hardener) |
| Appearance (Part A / Part B) | Amber transparent liquid / Pale yellow transparent liquid |
| Mix Ratio by Weight | 100 : 35 (A : B) |
| Working Life at 25°C | Approx. 60 minutes after mixing |
| Full Cure Time | 7 days at 25°C or 2 hours at 80°C |
| Density (25°C) | 1.12 g/cm³ (mixed) |
| VOC Content | <50 g/L (as per ASTM D6886) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China