Ultra-low modulus silicone gel formulation for stress-free encapsulation of sensitive electronic components.
Excellent dielectric strength and volume resistivity for high-voltage insulation and arc resistance.
Thermally stable across -50 °C to +200 °C with minimal thermal expansion and long-term aging resistance.
Two-part, platinum-catalyzed system offering precise mix ratio (1:1 by weight) and room-temperature cure.
Non-corrosive, halogen-free, and UL 94 V-0 rated for enhanced safety and regulatory compliance.
Insulation and protection of power electronics modules including IGBTs, SiC MOSFETs, and inverters.
Encapsulation of high-voltage battery management systems (BMS) and EV traction inverter assemblies.
Dielectric filling for transformers, capacitors, and high-frequency RF components in renewable energy systems.
Stress-relieving potting of LED drivers, medical power supplies, and aerospace-grade avionics interfaces.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid kit (Part A + Part B) |
| Appearance | Translucent, viscous liquid (Part A); colorless to pale amber liquid (Part B) |
| Mix Ratio (by weight) | 1:1 |
| Cure Condition | Room temperature (25 °C), 7 days for full cure; accelerated at 60 °C for 4 hours |
| Density (25 °C) | Approx. 1.08 g/cm³ (mixed) |
| Dielectric Strength (ASTM D149) | ≥20 kV/mm (1 mm thickness) |
| Volume Resistivity (ASTM D257) | ≥1 × 10¹⁵ Ω·cm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China