Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SYLGARD 3-6636 Silicone Dielectric Gel Kit

Dow SYLGARD 3-6636 Silicone Dielectric Gel Kit is a two-part platinum-cured silicone gel offering ultra-low modulus, excellent thermal stability, and superior dielectric insulation. Designed for potting, encapsulation, and gap-filling in electronics, it cures at room temperature or accelerated heat, ensuring stress relief and long-term reliability under thermal cycling.
  • dow sylgard 3 6636 silicone dielectric gel kit_ffa73438
  • dow sylgard 3 6636 silicone dielectric gel kit_ffa73438

Features Of Dow SYLGARD 3-6636 Silicone Dielectric Gel Kit

  1. Ultra-low modulus silicone gel formulation for stress-free encapsulation of sensitive electronic components.

  2. Excellent dielectric strength and volume resistivity for high-voltage insulation and arc resistance.

  3. Thermally stable across -50 °C to +200 °C with minimal thermal expansion and long-term aging resistance.

  4. Two-part, platinum-catalyzed system offering precise mix ratio (1:1 by weight) and room-temperature cure.

  5. Non-corrosive, halogen-free, and UL 94 V-0 rated for enhanced safety and regulatory compliance.

Typical Applications Of Dow SYLGARD 3-6636 Silicone Dielectric Gel Kit

  1. Insulation and protection of power electronics modules including IGBTs, SiC MOSFETs, and inverters.

  2. Encapsulation of high-voltage battery management systems (BMS) and EV traction inverter assemblies.

  3. Dielectric filling for transformers, capacitors, and high-frequency RF components in renewable energy systems.

  4. Stress-relieving potting of LED drivers, medical power supplies, and aerospace-grade avionics interfaces.

Specifications Of Dow SYLGARD 3-6636 Silicone Dielectric Gel Kit

Chemical TypePlatinum-catalyzed addition-cure silicone gel
Product FormTwo-component liquid kit (Part A + Part B)
AppearanceTranslucent, viscous liquid (Part A); colorless to pale amber liquid (Part B)
Mix Ratio (by weight)1:1
Cure ConditionRoom temperature (25 °C), 7 days for full cure; accelerated at 60 °C for 4 hours
Density (25 °C)Approx. 1.08 g/cm³ (mixed)
Dielectric Strength (ASTM D149)≥20 kV/mm (1 mm thickness)
Volume Resistivity (ASTM D257)≥1 × 10¹⁵ Ω·cm


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