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UV-curable silicone formulation enabling rapid, low-energy curing without heat or moisture dependency.
Excellent adhesion to challenging substrates including glass, metals, and engineered plastics.
High thermal stability with continuous service temperature range from −55 °C to 200 °C.
Outstanding electrical insulation properties and long-term dielectric performance.
Low modulus elasticity providing stress relief for bonded components under thermal cycling.
Optoelectronics assembly, including LED packaging and sensor encapsulation.
Automotive lighting modules requiring durable, transparent bonding under thermal stress.
Medical device assembly where biocompatibility and sterilization resistance are critical.
Consumer electronics bonding of camera lenses, displays, and precision optical components.
Industrial sensors and transducers requiring stable electrical isolation and environmental sealing.
| Chemical Type | UV-curable silicone adhesive |
| Product Form | Paste (thixotropic) |
| Appearance | Translucent off-white |
| Primary Applications | Optical bonding, electronic encapsulation, precision assembly |
| Key Features | UV cure, low outgassing, high transparency, thermal shock resistance |
| Benefits | Process efficiency, substrate versatility, long-term reliability, RoHS compliant |
| Cure Mechanism | UV-A (320–390 nm) initiated free-radical polymerization |
| Storage Condition | Refrigerated at 2–8 °C; protect from UV light and moisture |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
