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Two-component, addition-cure silicone elastomer system offering excellent flow and low viscosity for precise dispensing.
Fast room-temperature cure with optional heat acceleration, enabling high-throughput manufacturing.
Outstanding thermal stability and long-term reliability across -55 °C to +200 °C operating range.
Low compression set and superior elasticity retention after prolonged thermal aging.
UL 94 V-0 rated for flame resistance, supporting safety-critical electronic encapsulation requirements.
Encapsulation and potting of power electronics, including IGBT modules and EV inverters.
Thermal interface material (TIM) bonding for heat sinks and semiconductor packages.
Sealing and gasketing in automotive under-hood sensor assemblies.
Protective coating for LED lighting components exposed to thermal cycling and humidity.
Dielectric insulation for high-voltage battery management systems (BMS).
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-part kit (Part A: base; Part B: catalyst) |
| Appearance (Part A) | Translucent, low-viscosity liquid |
| Appearance (Part B) | Translucent, low-viscosity liquid |
| Mix Ratio (A:B by weight) | 10:1 |
| Cure Mechanism | Room temperature or elevated temperature (e.g., 60–125 °C) |
| Shore A Hardness (7 days, 23 °C) | 55 ± 5 |
| Primary Applications | Electronics encapsulation, thermal management, and environmental sealing |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
