High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to diverse substrates including glass, aluminum, stainless steel, and painted surfaces.
Offers outstanding resistance to thermal cycling, UV exposure, and weathering—maintaining flexibility and bond integrity from –55 °C to 200 °C.
Low modulus formulation provides superior stress relief for bonded assemblies subject to vibration or differential thermal expansion.
Non-corrosive and acetoxy-free cure chemistry—eliminates risk of metal corrosion and substrate damage during curing.
Meets UL 94 HB flammability rating and complies with RoHS and REACH regulatory requirements.
Structural bonding and sealing of architectural glazing systems, including curtain walls and insulating glass units (IGUs).
Electronic encapsulation and conformal coating for LED lighting modules and power electronics requiring thermal stability and electrical insulation.
Automotive interior assembly—bonding trim components, instrument panels, and decorative overlays on thermoplastics and coated metals.
Industrial appliance manufacturing, such as sealing and bonding of control panels, display housings, and HVAC components.
Renewable energy applications, including bonding of solar panel frames, junction boxes, and weatherproof enclosures.
| Chemical Type | One-component, moisture-curing, acetoxy-free silicone elastomer |
| Product Form | Paste-like, thixotropic, ready-to-use adhesive in cartridge (310 mL) and bulk (200 L drum) |
| Appearance | Off-white to light gray, uniform paste with no visible particles or phase separation |
| Primary Applications | Structural bonding, sealing, and gasketing in construction, electronics, automotive, and industrial equipment |
| Key Features | Low modulus, non-corrosive cure, excellent UV/thermal aging resistance, high elongation (>200%) |
| Benefits | Reduces assembly stress, eliminates post-cure baking, enables rapid handling strength development (tack-free in ~30 min) |
| Curing Mechanism | Moisture-cured at ambient temperature; full cure depth ~3–4 mm per 24 hours at 23 °C / 50% RH |
| Regulatory Compliance | RoHS 2015/863, REACH SVHC-free, UL 94 HB, ISO 10993-5 (cytotoxicity tested) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China