Two-component, addition-cure silicone adhesive system offering low viscosity and excellent flow characteristics for precise dispensing.
Fast room-temperature cure with optional heat acceleration, enabling rapid production throughput and reduced cycle times.
Exceptional adhesion to a broad range of substrates including metals, glass, ceramics, and engineered plastics without primers.
Outstanding thermal stability and long-term reliability across operating temperatures from –55 °C to +200 °C.
Low compression set and high elasticity ensure durable sealing and bonding performance under dynamic mechanical stress.
Aerospace component assembly requiring vibration-resistant structural bonding and environmental sealing.
Automotive sensor encapsulation and electronic control unit (ECU) potting where thermal management and dielectric integrity are critical.
Medical device assembly demanding biocompatibility-compliant materials and cleanroom-compatible processing.
Industrial LED lighting modules requiring optical clarity, thermal cycling resistance, and UV stability.
High-reliability power electronics packaging including inverters, converters, and battery module interconnects.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Two-part liquid kit (Part A: base; Part B: catalyst) |
| Appearance | Part A: translucent colorless to pale amber liquid; Part B: colorless to pale yellow liquid |
| Primary Applications | Structural bonding, encapsulation, potting, and gasketing |
| Key Features | Low viscosity, fast RT/heat cure, primerless adhesion, high elongation |
| Benefits | Improved manufacturing efficiency, enhanced reliability, reduced process complexity |
| Cure Mechanism | Addition reaction (no by-products) |
| Storage Stability | ≥6 months at 25 °C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China