High-performance film adhesive designed for aerospace-grade structural bonding.
Excellent resistance to elevated temperatures and thermal cycling (up to 177°C / 350°F service temperature).
Outstanding peel strength and fracture toughness in bonded composite-to-metal and composite-to-composite joints.
Controlled tack and handling characteristics for precise lay-up and minimal fiber disturbance during processing.
Compatible with standard autoclave cure cycles; no post-cure required for full property development.
Aerospace primary and secondary structures, including wing skins, fuselage panels, and empennage components.
Bonding of carbon fiber reinforced polymer (CFRP) laminates to aluminum or titanium substrates.
Repair of composite airframe structures under OEM-approved maintenance procedures.
Manufacturing of high-integrity bonded assemblies in military and commercial aircraft programs.
Structural bonding in space-grade components requiring low outgassing and long-term dimensional stability.
| Chemical Type | Toughened epoxy-based film adhesive |
| Product Form | Double-sided release liner protected film (standard thickness: 0.10 mm) |
| Appearance | Uniform amber-colored, flexible film |
| Primary Applications | Aerospace structural bonding (OEM-qualified per BMS 8-293, AER 2100-001) |
| Key Features | Autoclave-curable, zero volatile content, low moisture absorption |
| Benefits | Reduced risk of porosity, improved bond line consistency, and enhanced fatigue performance |
| Cure Schedule (Typical) | 177°C (350°F) at 0.69 MPa (100 psi) for 90 minutes |
| Shelf Life | 6 months at –18°C (0°F); 7 days at 23°C (73°F) after thawing |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China