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High thermal conductivity (≥ 1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation enables stress relief and accommodates thermal expansion mismatch between substrates.
Room-temperature vulcanizing (RTV) cure with excellent adhesion to metals, plastics, and ceramics without primer.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical applications.
Non-corrosive, acetoxy-free chemistry ensures compatibility with sensitive electronic components and solder finishes.
Thermal interface and sealing of power electronics modules, including IGBTs and inverters.
Heat sink attachment and gap-filling in LED lighting systems and automotive lighting assemblies.
Encapsulation and thermal management of onboard chargers (OBC), DC-DC converters, and battery control units (BCUs) in electric vehicles.
Sealing and thermal bonding of sensors, radar housings, and ADAS components exposed to wide temperature cycling.
| Chemical Type | Condensation-cure silicone elastomer |
| Product Form | Paste, thixotropic, non-sag |
| Appearance | Gray, uniform paste |
| Primary Applications | Thermal interface material (TIM), structural thermal sealant |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV cure |
| Benefits | Reduces interfacial thermal resistance, mitigates mechanical stress, enhances long-term reliability |
| Cure Mechanism | Moisture-cure at ambient conditions |
| Operating Temperature Range | −55 °C to +200 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
