High-performance, two-part epoxy adhesive formulated for demanding aerospace and industrial bonding applications.
Excellent resistance to thermal cycling, humidity, and jet fuel exposure per ASTM D5418 and BSS 7239.
Low outgassing characteristics, meeting ECSS-Q-ST-70-02C requirements for space-grade materials.
Toughened formulation providing high peel strength and impact resistance without brittle failure.
Room-temperature cure option with accelerated cure capability at elevated temperatures (e.g., 60–80 °C).
Aerospace structural bonding of composite-to-composite and composite-to-metal assemblies.
Primary and secondary bonding in commercial and military aircraft airframes.
Thermal management interfaces in satellite subsystems and avionics enclosures.
Bonding of honeycomb core panels and stiffeners in radomes and fairings.
Repair and rework of bonded structures under FAA/EASA-approved maintenance procedures.
| Chemical Type | Two-part aromatic amine-cured epoxy resin system |
| Product Form | Paste (Part A: resin; Part B: hardener), supplied in dual-cartridge or separate containers |
| Appearance | Part A: light tan paste; Part B: dark brown paste |
| Primary Applications | Structural bonding in aerospace, defense, and space platforms |
| Key Features | Low volatile content, NASA low-outgassing compliant, flame-retardant (BSS 7239 Class A) |
| Benefits | Reduced post-bond machining, excellent long-term durability under environmental stress, no solvents |
| Cure Schedule (Standard) | 24 h at 23 °C or 2 h at 80 °C after mixing |
| Shelf Life (Unopened) | 12 months at ≤25 °C; refrigerated storage recommended for extended stability |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China