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Ultra-low modulus formulation enables gentle stress relief for sensitive electronic components.
Excellent dielectric stability across wide temperature range (–40 °C to +200 °C).
Non-corrosive, platinum-catalyzed silicone chemistry ensures long-term material compatibility.
Thixotropic behavior provides easy dispensing and prevents slumping during cure.
UL 94 V-0 rated for flame resistance in demanding electronic encapsulation applications.
Thermal interface material (TIM) for power electronics and IGBT modules.
Dielectric encapsulation of high-voltage sensors and battery management systems (BMS).
Void-filling gel for LED lighting assemblies requiring electrical isolation and thermal management.
Protection layer for automotive ADAS radar and camera modules exposed to thermal cycling.
Conformal coating alternative for flexible printed circuits (FPCs) in wearable and medical devices.
| Chemical Type | Platinum-catalyzed addition-cure silicone |
| Product Form | Paste (two-component, Part A + Part B) |
| Appearance | Opaque white gel |
| Primary Applications | Dielectric encapsulation, thermal interface, stress-relieving potting |
| Key Features | Low modulus, non-slumping, UL 94 V-0, RoHS compliant |
| Shore A Hardness (7 days, 25 °C) | 10–15 |
| Density (g/cm³) | 1.15–1.20 |
| Dielectric Strength (kV/mm) | ≥20 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
