English
Español
tiếng việt
русский
Ultra-low modulus formulation enables conformal stress relief for sensitive electronic components.
Excellent dielectric strength and volume resistivity ensure reliable electrical insulation under high-voltage conditions.
Thermally stable across –50 °C to +200 °C, maintaining integrity during thermal cycling and power-on operation.
Non-corrosive and halogen-free, compatible with copper, aluminum, gold, and common PCB substrates.
Two-part, platinum-catalyzed system with low mixed viscosity for easy dispensing and void-free encapsulation.
High-voltage battery module potting and cell-to-cell gap filling in electric vehicles (EVs).
Insulating gel for power electronics, including IGBT modules, inverters, and DC–DC converters.
Thermal interface and dielectric protection in LED lighting arrays and solid-state lighting drivers.
Encapsulation of sensors, transformers, and high-frequency RF components requiring EMI suppression and moisture resistance.
Underfill and edge bonding for flexible printed circuits (FPCs) and automotive ADAS radar assemblies.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A: base; Part B: catalyst) |
| Appearance | Translucent, low-viscosity liquid (both parts) |
| Mix Ratio by Weight | 1:1 (A:B) |
| Cure Temperature | Room temperature (accelerated at 60–80 °C) |
| Density (25 °C) | Approx. 1.12 g/cm³ (mixed) |
| Dielectric Strength | ≥ 20 kV/mm (per ASTM D149) |
| Volume Resistivity | ≥ 1 × 10¹⁵ Ω·cm (per ASTM D257) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
