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Non-slump formulation maintains shape and position after dispensing, even on vertical or overhead surfaces.
Room-temperature curing silicone adhesive with low modulus for stress relief in bonded assemblies.
Excellent adhesion to a wide range of substrates including metals, plastics, glass, and ceramics.
Superior resistance to thermal cycling, UV exposure, and moisture over extended service life.
Low volatility and no corrosive by-products during cure — suitable for sensitive electronic and optical applications.
Optical bonding of lenses, displays, and touch panels in consumer electronics and automotive HUDs.
Structural attachment of sensors, housings, and thermal interface components in industrial equipment.
Sealing and bonding of LED lighting modules requiring long-term reliability under thermal stress.
Mounting of precision optical components in medical imaging and analytical instrumentation.
| Chemical Type | Two-part addition-cure silicone elastomer |
| Product Form | Paste (Part A) and liquid catalyst (Part B) |
| Appearance | Off-white paste (Part A); colorless to pale yellow liquid (Part B) |
| Primary Applications | Non-slump bonding, optical assembly, thermal and vibration damping |
| Key Features | Non-sag, RTV, low modulus, high elongation, halogen-free |
| Benefits | Minimizes rework, eliminates post-dispense leveling steps, supports automated dispensing |
| Cure Mechanism | Platinum-catalyzed hydrosilylation at room temperature |
| Shelf Life (Unopened) | 12 months at 25°C; refrigerated storage recommended for extended stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
