Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SYLGARD 535 Silicone Dielectric Gel

Dow SYLGARD 535 Silicone Dielectric Gel is a low-viscosity, platinum-cured silicone gel offering exceptional dielectric insulation, thermal stability (−50°C to 200°C), and stress relief for electronics. It remains tack-free, cures at room temperature, resists moisture/chemicals, and enables void-free encapsulation—ideal for high-reliability LED, power module, and EV battery applications.
  • dow sylgard 535 silicone dielectric gel_9365cb03
  • dow sylgard 535 silicone dielectric gel_9365cb03

Features Of Dow SYLGARD 535 Silicone Dielectric Gel

  1. Ultra-low modulus silicone gel formulation for stress-free encapsulation and conformal protection of sensitive electronic components.

  2. Excellent dielectric strength and stable electrical insulation properties across wide temperature and frequency ranges.

  3. Non-corrosive, platinum-cured chemistry with no by-products—safe for use with copper, aluminum, and delicate semiconductor surfaces.

  4. Thixotropic behavior enables easy dispensing and minimal flow after application, supporting precise localized coverage.

  5. Outstanding long-term thermal stability and resistance to thermal cycling from –50 °C to +200 °C.

Typical Applications Of Dow SYLGARD 535 Silicone Dielectric Gel

  1. High-voltage power electronics: IGBT modules, inverters, and EV traction inverters.

  2. LED lighting systems requiring thermal management and electrical isolation in compact form factors.

  3. Renewable energy systems: solar microinverters, DC optimizers, and battery management system (BMS) sensors.

  4. Automotive electronics: onboard chargers (OBC), DC-DC converters, and ADAS sensor housings.

Specifications Of Dow SYLGARD 535 Silicone Dielectric Gel

Chemical TypePlatinum-cured silicone gel
Product FormTwo-part liquid (Part A + Part B), mix ratio 10:1 by weight
AppearanceTranslucent, colorless to pale amber viscous liquid (uncured); soft, tack-free gel (cured)
Primary ApplicationsDielectric encapsulation, potting, and gap filling in high-reliability power electronics
Key FeaturesUltra-low modulus, self-healing surface, non-slumping, no shrinkage
BenefitsReduces mechanical stress on solder joints and wire bonds; extends device lifetime under thermal cycling
Cure ConditionsRoom temperature cure (7 days) or accelerated cure at 60 °C for 4 hours
UL RecognitionUL 94 V-0 flammability rating (per cured thickness ≥1.5 mm)


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