Ultra-low modulus silicone gel formulation for stress-free encapsulation and conformal protection of sensitive electronic components.
Excellent dielectric strength and stable electrical insulation properties across wide temperature and frequency ranges.
Non-corrosive, platinum-cured chemistry with no by-products—safe for use with copper, aluminum, and delicate semiconductor surfaces.
Thixotropic behavior enables easy dispensing and minimal flow after application, supporting precise localized coverage.
Outstanding long-term thermal stability and resistance to thermal cycling from –50 °C to +200 °C.
High-voltage power electronics: IGBT modules, inverters, and EV traction inverters.
LED lighting systems requiring thermal management and electrical isolation in compact form factors.
Renewable energy systems: solar microinverters, DC optimizers, and battery management system (BMS) sensors.
Automotive electronics: onboard chargers (OBC), DC-DC converters, and ADAS sensor housings.
| Chemical Type | Platinum-cured silicone gel |
| Product Form | Two-part liquid (Part A + Part B), mix ratio 10:1 by weight |
| Appearance | Translucent, colorless to pale amber viscous liquid (uncured); soft, tack-free gel (cured) |
| Primary Applications | Dielectric encapsulation, potting, and gap filling in high-reliability power electronics |
| Key Features | Ultra-low modulus, self-healing surface, non-slumping, no shrinkage |
| Benefits | Reduces mechanical stress on solder joints and wire bonds; extends device lifetime under thermal cycling |
| Cure Conditions | Room temperature cure (7 days) or accelerated cure at 60 °C for 4 hours |
| UL Recognition | UL 94 V-0 flammability rating (per cured thickness ≥1.5 mm) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China