High-performance thermoplastic adhesive based on polyamide chemistry for demanding bonding applications.
Excellent resistance to moisture, oils, and common industrial solvents at elevated temperatures.
Fast melt processing with low melt viscosity, enabling efficient extrusion, coating, and hot-melt application.
Strong adhesion to diverse substrates including metals, engineering plastics (e.g., PA, PBT, PC), and coated papers.
Halogen-free formulation compliant with RoHS and REACH regulatory requirements.
Aerospace interior bonding: attachment of trim panels, insulation blankets, and composite overlays.
Automotive under-hood assemblies: sensor mounting, gasket lamination, and heat-shield fixation.
Electronics encapsulation and component tacking in high-reliability modules.
Industrial filtration media lamination for HVAC and cleanroom filter elements.
Medical device assembly requiring biocompatibility-supporting processing and sterilization stability.
| Chemical Type | Polyamide-based thermoplastic adhesive |
| Product Form | Pellets |
| Appearance | Off-white to light beige granules |
| Melt Flow Rate (235°C/2.16 kg) | 18–22 g/10 min |
| Melt Temperature Range | 170–190°C |
| Softening Point (ASTM E28) | 175–185°C |
| Density (23°C) | 1.04–1.07 g/cm³ |
| Primary Applications | Structural lamination, thermal interface bonding, and high-temp assembly |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China