Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay MX 4926N Adhesive

Solvay MX 4926N Adhesive is a high-performance thermoplastic polyimide film adhesive from Solvay’s MX series, engineered for aerospace and electronics bonding. It offers exceptional thermal stability (>300°C), chemical resistance, and peel strength on composites and metals. Supplied as a pressure-sensitive tape, it cures without autoclave, enabling rapid, low-void laminations with outstanding dimensional stability and outgassing compliance.
  • solvay mx 4926n adhesive_229f3beb
  • solvay mx 4926n adhesive_229f3beb

Features Of Solvay MX 4926N Adhesive

  1. High-performance thermoplastic polyimide-based formulation offering exceptional thermal stability up to 300 °C continuous service.

  2. Excellent adhesion to challenging substrates including carbon fiber composites, titanium, and ceramic-coated metals.

  3. Solvent-free, low-outgassing composition certified for aerospace and vacuum environments (per ASTM E595).

  4. Fast tack development with room-temperature handling capability, enabling efficient pre-assembly before final cure.

  5. Outstanding resistance to hydrolysis, jet fuels, hydraulic fluids, and broad-spectrum aerospace-grade solvents.

Typical Applications Of Solvay MX 4926N Adhesive

  1. Aerospace structural bonding of engine nacelles, fan cowls, and hot-section components.

  2. Thermal interface bonding in high-temperature avionics housings and power electronics enclosures.

  3. Attachment of strain sensors and piezoelectric transducers on turbine blades and exhaust systems.

  4. Repair and refurbishment of composite-to-metal joints in military and commercial aircraft airframes.

  5. Bonding of ceramic matrix composite (CMC) heat shields in next-generation propulsion systems.

Specifications Of Solvay MX 4926N Adhesive

Chemical TypeThermoplastic Polyimide
Product FormPre-cut film (standard thickness: 0.10 mm)
AppearanceAmber, semi-transparent flexible film
Primary ApplicationsHigh-temperature structural bonding and thermal management
Key FeaturesSolvent-free, low outgassing, peelable edge, no refrigeration required
Recommended Cure Cycle280 °C for 60 minutes under 0.7 MPa pressure
Storage ConditionsRoom temperature (15–25 °C), dry environment, ≤12 months shelf life
ComplianceREACH SVHC-free, RoHS 3 compliant, AS9100 traceable lot documentation


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