High-performance thermoplastic polyimide-based formulation offering exceptional thermal stability up to 300 °C continuous service.
Excellent adhesion to challenging substrates including carbon fiber composites, titanium, and ceramic-coated metals.
Solvent-free, low-outgassing composition certified for aerospace and vacuum environments (per ASTM E595).
Fast tack development with room-temperature handling capability, enabling efficient pre-assembly before final cure.
Outstanding resistance to hydrolysis, jet fuels, hydraulic fluids, and broad-spectrum aerospace-grade solvents.
Aerospace structural bonding of engine nacelles, fan cowls, and hot-section components.
Thermal interface bonding in high-temperature avionics housings and power electronics enclosures.
Attachment of strain sensors and piezoelectric transducers on turbine blades and exhaust systems.
Repair and refurbishment of composite-to-metal joints in military and commercial aircraft airframes.
Bonding of ceramic matrix composite (CMC) heat shields in next-generation propulsion systems.
| Chemical Type | Thermoplastic Polyimide |
| Product Form | Pre-cut film (standard thickness: 0.10 mm) |
| Appearance | Amber, semi-transparent flexible film |
| Primary Applications | High-temperature structural bonding and thermal management |
| Key Features | Solvent-free, low outgassing, peelable edge, no refrigeration required |
| Recommended Cure Cycle | 280 °C for 60 minutes under 0.7 MPa pressure |
| Storage Conditions | Room temperature (15–25 °C), dry environment, ≤12 months shelf life |
| Compliance | REACH SVHC-free, RoHS 3 compliant, AS9100 traceable lot documentation |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China