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Non-flowing, thixotropic silicone gel that maintains position on vertical and inverted surfaces without sagging or slumping.
Excellent dielectric insulation properties with high dielectric strength and low dielectric loss across wide temperature and frequency ranges.
Thermally stable from –50 °C to +200 °C, enabling reliable performance in extreme operating environments.
Low modulus and stress-relieving characteristics minimize mechanical stress on delicate electronic components and wire bonds.
Chemically inert, non-corrosive, and compatible with common PCB substrates, plastics, metals, and elastomers.
High-voltage insulation and potting of power electronics modules, including IGBTs and inverters.
Dielectric encapsulation of sensors, transformers, and busbar assemblies in electric vehicle (EV) power systems.
Gap-filling and conformal protection for LED drivers and solid-state lighting (SSL) housings.
Stress-free insulation of fine-pitch semiconductor packages and MEMS devices during thermal cycling.
| Chemical Type | Dimethyl siloxane-based thixotropic silicone gel |
| Product Form | Paste (ready-to-use, two-component system requiring mixing) |
| Appearance | Opaque white to off-white viscous paste |
| Primary Applications | High-voltage dielectric insulation, thermal interface, and mechanical stress relief |
| Key Features | Thixotropic, non-sagging, low modulus, electrically insulating |
| Benefits | Eliminates air gaps, reduces thermal resistance, prevents corona discharge, protects against moisture and contaminants |
| Cure Mechanism | Platinum-catalyzed addition cure (heat accelerated) |
| Shelf Life (unopened, 25 °C) | 12 months in original sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
