Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow SYLGARD 567 Primerless Silicone Encapsulant Kit

Dow SYLGARD 567 Primerless Silicone Encapsulant Kit is a two-part, addition-cure silicone system offering excellent thermal stability, low stress on delicate components, and reliable adhesion to common substrates without primer. Ideal for LED, power electronics, and aerospace encapsulation, it cures rapidly at room temperature or elevated heat with minimal shrinkage and superior dielectric properties.
  • dow sylgard 567 primerless silicone encapsulant kit_c53772af
  • dow sylgard 567 primerless silicone encapsulant kit_c53772af

Features Of Dow SYLGARD 567 Primerless Silicone Encapsulant Kit

  1. Primerless adhesion to a broad range of substrates including FR-4, aluminum, copper, and common plastics—eliminating pre-treatment steps and reducing process complexity.

  2. Low-viscosity, two-part addition-cure silicone formulation enabling excellent flow, self-leveling, and void-free encapsulation of fine-pitch components.

  3. Excellent thermal stability with continuous use temperature up to 200 °C and outstanding resistance to thermal cycling and mechanical stress.

  4. UL 94 V-0 flammability rating and low ionic content for high reliability in sensitive electronic applications.

  5. Non-corrosive, platinum-catalyzed cure system with no by-products—ideal for hermetic and optoelectronic assemblies requiring long-term stability.

Typical Applications Of Dow SYLGARD 567 Primerless Silicone Encapsulant Kit

  1. Encapsulation and protection of power electronics modules, including IGBTs and SiC-based devices.

  2. Underfill and edge bonding for LED packages and high-brightness lighting arrays.

  3. Dielectric isolation and environmental protection of automotive sensors and ECUs exposed to under-hood conditions.

  4. Conformal coating and potting of aerospace avionics and downhole oil & gas instrumentation.

  5. Protection of flexible printed circuits (FPCs) and wearable electronics requiring soft, compliant encapsulation.

Specifications Of Dow SYLGARD 567 Primerless Silicone Encapsulant Kit

Chemical TypePlatinum-catalyzed addition-cure silicone elastomer
Product FormTwo-component liquid kit (Part A: base; Part B: catalyst)
Appearance (Uncured)Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid
Mix Ratio (by weight)10:1 (A:B)
Cure Conditions1 hour at 150 °C or 24 hours at 25 °C (ambient cure possible with extended time)
Hardness (Shore A, cured)30–35
Density (g/cm³, cured)1.15–1.18
UL RecognitionUL 94 V-0 (per UL 746C), certified per UL File E309395


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