Primerless adhesion to a broad range of substrates including FR-4, aluminum, copper, and common plastics—eliminating pre-treatment steps and reducing process complexity.
Low-viscosity, two-part addition-cure silicone formulation enabling excellent flow, self-leveling, and void-free encapsulation of fine-pitch components.
Excellent thermal stability with continuous use temperature up to 200 °C and outstanding resistance to thermal cycling and mechanical stress.
UL 94 V-0 flammability rating and low ionic content for high reliability in sensitive electronic applications.
Non-corrosive, platinum-catalyzed cure system with no by-products—ideal for hermetic and optoelectronic assemblies requiring long-term stability.
Encapsulation and protection of power electronics modules, including IGBTs and SiC-based devices.
Underfill and edge bonding for LED packages and high-brightness lighting arrays.
Dielectric isolation and environmental protection of automotive sensors and ECUs exposed to under-hood conditions.
Conformal coating and potting of aerospace avionics and downhole oil & gas instrumentation.
Protection of flexible printed circuits (FPCs) and wearable electronics requiring soft, compliant encapsulation.
| Chemical Type | Platinum-catalyzed addition-cure silicone elastomer |
| Product Form | Two-component liquid kit (Part A: base; Part B: catalyst) |
| Appearance (Uncured) | Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid |
| Mix Ratio (by weight) | 10:1 (A:B) |
| Cure Conditions | 1 hour at 150 °C or 24 hours at 25 °C (ambient cure possible with extended time) |
| Hardness (Shore A, cured) | 30–35 |
| Density (g/cm³, cured) | 1.15–1.18 |
| UL Recognition | UL 94 V-0 (per UL 746C), certified per UL File E309395 |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China