Non-corrosive, silicone-based formulation safe for sensitive electronic components and metallizations.
Excellent dielectric insulation with stable performance across wide temperature range (−50 °C to +200 °C).
Thixotropic gel consistency enables precise dispensing and prevents migration or slumping after application.
Low volatility and minimal outgassing — meets NASA low-outgassing requirements (ASTM E595).
Re-workable and non-curing: remains permanently tacky and compliant for long-term stress relief and thermal cycling accommodation.
Insulation and protection of high-voltage battery module busbars and interconnects in EV powertrains.
Dielectric filling for LED lighting assemblies exposed to thermal shock and humidity.
Gap-filling encapsulation for power electronics in renewable energy inverters and converters.
Protection of sensors, connectors, and PCB edge interfaces in automotive ADAS systems.
Dielectric barrier layer in aerospace avionics housings requiring EMI/RFI shielding compatibility.
| Chemical Type | Dimethyl silicone polymer base with fumed silica thickener |
| Product Form | Paste-like, thixotropic gel (kit includes base and catalyst) |
| Appearance | Off-white to light beige, homogeneous gel |
| Primary Applications | High-voltage insulation, thermal interface, conformal gap fill, electrical isolation |
| Key Features | Non-curing, re-workable, low-outgassing, non-corrosive, UL 94 HB rated |
| Shelf Life (unopened) | 12 months at 25 °C in original sealed packaging |
| Operating Temperature Range | −50 °C to +200 °C (continuous) |
| Dielectric Strength (ASTM D149) | ≥20 kV/mm (at 1 mm thickness, 60 Hz) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China