High purity bisphenol-A based solid epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature processing environments.
Superior adhesion to metals, glass, and composite substrates without requiring surface priming.
Low ionic chloride content (< 500 ppm), minimizing corrosion risk in electronic encapsulation applications.
Good melt viscosity profile enabling uniform flow and void-free casting or molding.
Electrical insulation and potting compounds for transformers and high-voltage components.
Structural adhesives for aerospace and automotive composite bonding.
Encapsulants for LED modules and power semiconductor devices.
Matrix resin in filament-wound pressure vessels and industrial piping systems.
Base resin for flame-retardant composites meeting UL 94 V-0 requirements (when compounded with appropriate additives).
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Pale yellow to amber solid flakes |
| Appearance | Free-flowing crystalline flakes |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melting Point | 88–93 °C |
| Softening Point (Ring & Ball) | 86–91 °C |
| Chloride Content | ≤ 500 ppm |
| Volatiles (105 °C, 2 hrs) | ≤ 0.3 wt% |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China