Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

EP-4100HF Epoxy Resin

EP-4100HF Epoxy Resin by EPICET is a high-flow, low-viscosity, halogen-free epoxy system designed for advanced electronics encapsulation and underfill applications. It offers excellent thermal stability, moisture resistance, and fine-gap filling capability with minimal void formation. Ideal for flip-chip and CSP packaging, it ensures reliable interconnect protection and superior dielectric performance in demanding semiconductor environments.
  • ep 4100hf epoxy resin_02e52d3b
  • ep 4100hf epoxy resin_02e52d3b

Features Of EP-4100HF Epoxy Resin

  1. High fluidity with low viscosity for excellent processability in vacuum infusion and resin transfer molding (RTM).

  2. Enhanced heat resistance with glass transition temperature (Tg) exceeding 180 °C after post-cure.

  3. Excellent adhesion to carbon fiber, fiberglass, and metal substrates without surface priming.

  4. Low halogen content meeting IPC-4101D and RoHS-compliant requirements for electronics-grade applications.

  5. Controlled reactivity enabling extended pot life (>6 hours at 25 °C) while maintaining rapid cure kinetics under elevated temperature.

Typical Applications Of EP-4100HF Epoxy Resin

  1. Aerospace structural composites including winglets, fairings, and interior panels.

  2. High-performance wind turbine blade root sections and spar caps.

  3. Electronics encapsulation and underfill for power modules requiring thermal stability.

  4. Racing automotive body panels and chassis components demanding dimensional stability at elevated service temperatures.

  5. Industrial tooling matrices for composite mold manufacturing.

Specifications Of EP-4100HF Epoxy Resin

Chemical TypeDiglycidyl ether of bisphenol-F (DGEBF) based epoxy resin
Product FormClear to pale amber liquid
AppearanceHomogeneous, low-viscosity liquid, free from gels or particulates
Brookfield Viscosity (25 °C)450–650 cP
Epoxy Equivalent Weight (EEW)175–185 g/eq
Chlorine Content (Total Cl)< 900 ppm
Density (25 °C)1.16–1.18 g/cm³
Storage Stability12 months at ≤25 °C in sealed containers


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