High fluidity with low viscosity for excellent processability in vacuum infusion and resin transfer molding (RTM).
Enhanced heat resistance with glass transition temperature (Tg) exceeding 180 °C after post-cure.
Excellent adhesion to carbon fiber, fiberglass, and metal substrates without surface priming.
Low halogen content meeting IPC-4101D and RoHS-compliant requirements for electronics-grade applications.
Controlled reactivity enabling extended pot life (>6 hours at 25 °C) while maintaining rapid cure kinetics under elevated temperature.
Aerospace structural composites including winglets, fairings, and interior panels.
High-performance wind turbine blade root sections and spar caps.
Electronics encapsulation and underfill for power modules requiring thermal stability.
Racing automotive body panels and chassis components demanding dimensional stability at elevated service temperatures.
Industrial tooling matrices for composite mold manufacturing.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) based epoxy resin |
| Product Form | Clear to pale amber liquid |
| Appearance | Homogeneous, low-viscosity liquid, free from gels or particulates |
| Brookfield Viscosity (25 °C) | 450–650 cP |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Chlorine Content (Total Cl) | < 900 ppm |
| Density (25 °C) | 1.16–1.18 g/cm³ |
| Storage Stability | 12 months at ≤25 °C in sealed containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China