High-performance dicyandiamide-based curing agent for epoxy resins with controlled reactivity.
Enables excellent thermal stability and long pot life in one-component epoxy systems.
Delivers superior mechanical properties, including high glass transition temperature (Tg) and dimensional stability.
Low volatility and low dust formation — enhances occupational safety and handling convenience.
Compatible with standard epoxy resins and suitable for solvent-free and low-VOC formulations.
Electrical insulation materials for transformers, bushings, and encapsulation compounds.
Structural adhesives requiring high heat resistance and long-term reliability.
Powder coatings for automotive and industrial metal substrates.
Prepregs and laminates in printed circuit board (PCB) manufacturing.
Composite matrices for aerospace and wind energy components.
| Chemical Type | Dicyandiamide derivative |
| Product Form | Fine crystalline powder |
| Appearance | White to off-white free-flowing powder |
| Primary Applications | One-component epoxy systems, powder coatings, electrical encapsulants |
| Key Features | Controlled reactivity, high Tg capability, low volatility |
| Benefits | Extended shelf life, improved process safety, enhanced thermal performance |
| Storage Conditions | Store in cool, dry place; protect from moisture and direct sunlight |
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E-mail: wangxingqiang@ericwchem.com
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