Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik Dynasylan Crosslinker Amide Bis(N-methylbenzamide)ethoxysilane

Evonik Dynasylan® AMEO-2 amide bis(N-methylbenzamide)ethoxysilane is a reactive silane crosslinker from the Dynasylan® series. It enhances adhesion, moisture resistance, and mechanical performance in coatings, sealants, and composites. Its dual N-methylbenzamide groups enable efficient covalent bonding with polymers and inorganic substrates while maintaining hydrolytic stability.
  • evonik dynasylan crosslinker amide bis n methylbenzamide ethoxysilane_ae9f3bd1
  • evonik dynasylan crosslinker amide bis n methylbenzamide ethoxysilane_ae9f3bd1

Features Of Evonik Dynasylan Crosslinker Amide Bis(N-methylbenzamide)ethoxysilane

  1. Amide-functional silane offering enhanced hydrolytic stability compared to conventional aminoalkylsilanes.

  2. Two reactive ethoxy groups enable efficient covalent bonding with inorganic surfaces and matrix resins.

  3. N-methylbenzamide moieties provide improved compatibility with aromatic polymer systems and reduced volatility.

  4. Enables moisture-cured crosslinking without strong odor or amine-related discoloration issues.

  5. Designed for high-performance hybrid coatings, adhesives, and sealants requiring durable interfacial adhesion.

Typical Applications Of Evonik Dynasylan Crosslinker Amide Bis(N-methylbenzamide)ethoxysilane

  1. Automotive clearcoats and primer-surfacer systems requiring scratch resistance and UV stability.

  2. High-solids and low-VOC industrial coatings for metal and composite substrates.

  3. Structural adhesives for bonding aluminum, glass, and carbon fiber reinforced polymers (CFRP).

  4. Moisture-curing silicone-modified polyurethane (SPUR) and polysulfide sealants.

Specifications Of Evonik Dynasylan Crosslinker Amide Bis(N-methylbenzamide)ethoxysilane

Chemical TypeAmide-functional alkoxysilane
Product FormLiquid
AppearanceColorless to pale yellow transparent liquid
Primary ApplicationsHybrid coatings, structural adhesives, moisture-curing sealants
Key FeaturesHydrolytic stability, low volatility, non-discoloring, dual ethoxy reactivity
BenefitsImproved substrate adhesion, extended pot life, reduced VOC contribution, compatibility with aromatic resins
Molecular Weight (approx.)410–430 g/mol
Storage ConditionsStore in tightly closed containers at 5–30 °C; protect from moisture


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