Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Evonik TEGO Dispers 740W Dispersant

Evonik TEGO Dispers 740W is a high-performance water-based polymeric dispersant designed for pigment stabilization in aqueous coatings and inks. It delivers excellent wetting, grinding efficiency, and long-term colloidal stability with low foaming and good compatibility across latexes and rheology modifiers.
  • evonik tego dispers 740w dispersant_f819581d
  • evonik tego dispers 740w dispersant_f819581d

Features Of Evonik TEGO Dispers 740W Dispersant

  1. High-efficiency wetting and deflocculation of inorganic pigments and fillers in waterborne systems.

  2. Excellent stabilization against sedimentation and viscosity increase over extended storage periods.

  3. Low-foaming formulation compatible with a broad range of water-based coatings and construction chemicals.

  4. Enables high pigment loading while maintaining low viscosity and good flow properties.

  5. Non-ionic, APEO-free, and compliant with major global regulatory frameworks for sustainable formulations.

Typical Applications Of Evonik TEGO Dispers 740W Dispersant

  1. Architectural waterborne interior and exterior wall paints.

  2. Water-based industrial maintenance coatings.

  3. Cementitious and polymer-modified tile adhesives and grouts.

  4. Waterborne printing inks for packaging and decorative applications.

  5. Mineral-based plasters and renders with high filler content.

Specifications Of Evonik TEGO Dispers 740W Dispersant

Chemical TypeNon-ionic polyether copolymer
Product FormPale yellow to light amber liquid
AppearanceClear to slightly hazy, homogeneous liquid
pH (1% aqueous solution, 20 °C)6.0 – 7.5
Density (20 °C)1.03 – 1.06 g/cm³
Solubility in WaterCompletely miscible
VOC Content< 10 g/L
Primary ApplicationsPigment & filler dispersion in waterborne coatings, construction chemicals, and inks


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *