Low-viscosity liquid formulation enabling excellent mixing and dispersion in epoxy resins.
Fast ambient-cure capability with full hardness development within 24–48 hours at 25°C.
Exceptional chemical resistance—particularly to alkalis, solvents, and mild acids after full cure.
Low exotherm profile, minimizing thermal stress and warpage in thick-section castings and coatings.
Halogen-free and REACH-compliant, supporting sustainable industrial manufacturing requirements.
High-performance epoxy flooring systems for pharmaceutical and cleanroom facilities.
Electrical encapsulation and potting compounds for transformers and power electronics.
Marine-grade protective coatings for offshore platforms and ship hulls.
Structural adhesive formulations used in wind turbine blade assembly and composite bonding.
Self-leveling epoxy mortars and grouts for heavy-duty industrial concrete repair.
| Chemical Type | Amine-modified polyamide adduct |
| Product Form | Low-viscosity liquid |
| Appearance | Pale yellow to amber transparent liquid |
| Density (25°C) | 0.96–0.99 g/cm³ |
| Viscosity (25°C) | 300–600 mPa·s |
| Amine Value | 280–320 mg KOH/g |
| Primary Applications | Epoxy resin curing for coatings, adhesives, and composites |
| Key Features | Ambient-cure, low exotherm, halogen-free, good flexibility |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China