SMF-175S is a premium high-purity modified epoxy resin in Kukdo’s SMF series, designed for precision electronic packaging and high-end composite molding. It features excellent low viscosity and dielectric properties, adapting to precision pouring and molding processes.
High-purity formula - Extremely low impurity content, suitable for precision electronic applications
Low viscosity liquid system - Excellent fluidity, easy to penetrate and fill micro gaps
Superior dielectric properties - High insulation strength, ensuring safety and stability of electronic components
Wide compatibility - Suitable for various electronic-grade curing agents and filler systems
Efficient processing characteristics - Controllable curing speed, good dimensional stability after molding
Precision electronic packaging - Potting protection of microelectronic components and sensors
High-end composite materials - Molding of precision composite components
Electronic insulation coatings - Preparation of insulation coatings for high-frequency electronic devices
Precision adhesives - High-strength bonding of micro components
Optical material substrates - Substrates for packaging and bonding of optical components
| Appearance | Colorless Transparent Liquid |
| Epoxy Equivalent (g/eq) | 170-185 |
| Viscosity (25℃, cps) | 1800-2800 |
| Color (G) | ≤2 |
| Hydrolyzable Chlorine (ppm) | ≤150 |
| Metal Impurities (ppm) | ≤50 |
| Solid Content (%) | 100 |
| Density (20℃, g/cm³) | 1.13-1.15 |
| Glass Transition Temperature (Tg, ℃) | 110-120 |
| Dielectric Constant (1kHz) | 3.2-4.0 |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China