High molecular weight solid bisphenol-A epoxy resin with excellent thermal stability.
Low volatile organic compound (VOC) content, supporting sustainable manufacturing practices.
Consistent batch-to-batch performance and narrow molecular weight distribution.
Excellent compatibility with common epoxy hardeners, including anhydrides and diamines.
Superior electrical insulation properties and high dielectric strength.
Electrical encapsulation and potting compounds for transformers and sensors.
High-performance powder coatings for metal substrates requiring corrosion resistance.
Structural adhesives in aerospace and automotive composites.
Prepreg matrices for advanced carbon fiber laminates.
| Chemical Type | Bisphenol-A based solid epoxy resin |
| Product Form | Pale yellow to amber solid flakes or pellets |
| Appearance | Free-flowing, homogeneous solid |
| Epoxy Equivalent Weight (EEW) | 475–495 g/eq |
| Melting Point | 85–95 °C |
| Softening Point (Ring & Ball) | 80–90 °C |
| Volatiles Content | ≤ 0.5 wt% |
| Color (Gardner Scale) | ≤ 3 |
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E-mail: wangxingqiang@ericwchem.com
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