High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good adhesion to metals, glass fibers, and cured polymer substrates under ambient and elevated cure conditions.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting compounds.
Structural adhesives in automotive and aerospace composite bonding applications.
Matrix resin for filament-wound pressure vessels and high-strength fiberglass laminates.
Coating systems requiring chemical resistance and mechanical durability in industrial equipment.
Wind turbine blade bonding and structural reinforcement in renewable energy composites.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | ≤ 500 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Primary Applications | Encapsulation, composites, adhesives, coatings |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China