Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

KUKDO YD-128SM Epoxy Resin

KUKDO YD-128SM Epoxy Resin is a low-viscosity, high-purity bisphenol-A based liquid epoxy offering excellent adhesion, chemical resistance and mechanical strength. Widely used in composites, electrical encapsulation and structural adhesives. Compatible with common amine and anhydride hardeners. Meets RoHS compliance with low chloride content and superior thermal stability. Ideal for demanding industrial applications requiring consistent performance and processability.
  • kukdo yd 128sm epoxy resin_42e104b0
  • kukdo yd 128sm epoxy resin_42e104b0

Features Of KUKDO YD-128SM Epoxy Resin

  1. High-purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.

  2. Excellent compatibility with common amine and anhydride curing agents for broad formulation flexibility.

  3. Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.

  4. Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.

  5. Good adhesion to metals, glass fibers, and cured polymer substrates under ambient and elevated cure conditions.

Typical Applications Of KUKDO YD-128SM Epoxy Resin

  1. Electrical and electronic encapsulants for transformers, sensors, and PCB potting compounds.

  2. Structural adhesives in automotive and aerospace composite bonding applications.

  3. Matrix resin for filament-wound pressure vessels and high-strength fiberglass laminates.

  4. Coating systems requiring chemical resistance and mechanical durability in industrial equipment.

  5. Wind turbine blade bonding and structural reinforcement in renewable energy composites.

Specifications Of KUKDO YD-128SM Epoxy Resin

Chemical TypeBisphenol-A epoxy resin
Product FormClear to pale yellow viscous liquid
AppearanceTransparent, slightly yellow, homogeneous liquid
Epoxy Equivalent Weight (EEW)185–192 g/eq
Viscosity (25°C)10,000–12,000 cP
Chloride Content≤ 500 ppm
Volatiles Content≤ 0.3 wt%
Primary ApplicationsEncapsulation, composites, adhesives, coatings


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