High reactivity with amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and fiber-reinforced substrates without primer requirement.
Low viscosity (1,800–2,200 mPa·s at 25°C) for superior processability in impregnation and resin transfer molding (RTM).
Enhanced thermal stability with glass transition temperature (Tg) of ~125°C after full cure with DDS.
Low chloride ion content (<50 ppm), minimizing corrosion risk in electronic and aerospace applications.
Aerospace structural composites, including winglets and interior panels.
High-voltage electrical insulation components for transformers and switchgear.
Wind turbine blade root joints and spar cap infusion systems.
Automotive under-hood components requiring dimensional stability at elevated temperatures.
Prepregs for carbon fiber laminates used in sporting goods and industrial tooling.
| Chemical Type | Diglycidyl ether of bisphenol-F (DGEBF) |
| Product Form | Liquid resin |
| Appearance | Pale yellow to amber transparent liquid |
| Epoxy Equivalent Weight (EEW) | 172–178 g/eq |
| Viscosity (25°C) | 1,800–2,200 mPa·s |
| Chloride Content | <50 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥12 months at 5–30°C in sealed container |
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E-mail: wangxingqiang@ericwchem.com
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