High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and low dielectric loss suitable for electronic encapsulation.
Good adhesion to metals, glass, and composite substrates under ambient and elevated cure conditions.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting.
High-performance composites in wind turbine blades and aerospace structural laminates.
Adhesives for automotive bonding applications requiring thermal and chemical resistance.
Coating systems for corrosion protection of steel infrastructure and marine equipment.
Tooling resins for precision molds used in composite manufacturing and prototyping.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China