High purity bisphenol-A based liquid epoxy resin with low chloride content.
Excellent compatibility with standard amine and anhydride curing agents.
Superior electrical insulation properties and thermal stability.
Low viscosity for easy processing, impregnation, and casting applications.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical encapsulation and potting of transformers, reactors, and insulators.
High-voltage composite insulator housings and bushing materials.
Winding impregnation resins for motors, generators, and inductors.
Structural adhesives requiring high dielectric strength and moisture resistance.
Prepreg systems for laminates used in printed circuit board (PCB) substrates.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chloride Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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