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High reactivity with standard amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without requiring surface priming.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing via casting, impregnation, and filament winding.
Superior thermal stability with glass transition temperature (Tg) exceeding 125°C after full cure.
Low volatile organic compound (VOC) content, compliant with REACH and RoHS directives.
Electrical insulation systems for medium-voltage transformers and busbar encapsulation.
Structural adhesive formulations for automotive lightweight composite bonding.
Matrix resin in fiber-reinforced polymer (FRP) pultrusion profiles for corrosion-resistant infrastructure.
Encapsulants for power electronics modules requiring high thermal conductivity and dielectric integrity.
Wind turbine blade root joints and spar cap infusion resins.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale amber viscous liquid |
| Appearance | Homogeneous, free of gels or sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content | < 800 ppm (total chlorine) |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at < 30°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
