Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Kukdo Chemical SM-019 Epoxy Resin

SM-019 is a high-molecular-weight solid bisphenol A epoxy resin from Guodu Chemical's SM series, specifically designed for high-temperature curing coating systems. This product is obtained through deep polymerization and modification of bisphenol A epoxy resin, possessing excellent high-temperature resistance and mechanical toughness. The cured coating has a dense structure and exhibits superior chemical resistance and substrate adhesion, making it compatible with various thermosetting systems such as phenolic and amino resins.

Features Of Kukdo Chemical SM6091 Epoxy Resin

  • Excellent flexibility and bending resistance - Outstanding T-bend performance, no cracking or peeling during bending and stamping

  • Super strong substrate adhesion - Good wettability to metal substrates, firm bonding with excellent adhesion

  • Superior corrosion protection - Resistant to salt spray and chemical media, long-lasting and stable protective effect

  • Good processing adaptability - Suitable for automatic spraying, with fine film formation and excellent leveling

  • Wide curing compatibility - Good compatibility with amino and phenolic resins, performance improved after thermal crosslinking

Typical Applications Of Kukdo Chemical SM6091 Epoxy Resin

  • PCM Coil Coatings - Manufacturing of primer and backcoat for high-end home appliance and construction PCM coils

  • Metal Packaging Coatings - Protective and decorative coatings for inner walls of food cans and metal containers

  • Auto Parts Coatings - Protective coatings for automotive interior metal parts, enhancing weather resistance and wear resistance

  • High-End Color-Coated Sheet Coatings - High-performance protective coatings for construction and home appliance color-coated sheets

  • Metal Printing Inks - Resin component for metal surface printing inks, enhancing adhesion and durability

Specifications Of Kukdo Chemical SM6091 Epoxy Resin

AppearanceLight Yellow to Yellow Solid Granule/Flake
TypeSolid Bisphenol A Epoxy Resin
Epoxy Equivalent (g/eq)2400-4000
Softening Point (℃)130-150
Color (Gardner)≤3
Density (20℃, g/cm³)1.17-1.22
Volatile Content (%)≤1.0
Solid Content (%)100
Applicable SubstratesCold-Rolled Steel, Galvanized Steel, Aluminum Plate and other Metal Substrates


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