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High reactivity with amine and anhydride curing agents for rapid gelation and short cycle times.
Excellent adhesion to metals, composites, and treated plastics without primer requirement.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy handling, degassing, and impregnation of fiber reinforcements.
Good thermal stability with glass transition temperature (Tg) up to 130°C after post-cure.
Low chloride content (< 500 ppm) ensuring superior electrical insulation and corrosion resistance in critical components.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural composites for wind turbine blades and aerospace secondary structures.
Prepreg systems for carbon fiber and fiberglass laminates requiring medium-temperature cure profiles.
High-performance adhesives for automotive powertrain and battery module bonding.
Castings and tooling resins for precision molds and jigs in industrial manufacturing.
| Chemical Type | Bisphenol-F based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or suspended matter |
| Epoxy Equivalent Weight (EEW) | 175–185 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | 20–25°C |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
