High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent chemical resistance to alkalis, solvents, and diluted acids after full curing.
Low viscosity (4,000–6,000 cP at 25°C) enabling easy processing, impregnation, and air release.
Superior adhesion to metals, composites, and cured polymer substrates without primer.
Good electrical insulation properties with high dielectric strength and volume resistivity.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace composite bonding and automotive metal-to-composite joints.
Matrix resin in filament-wound pressure vessels and FRP tanks requiring corrosion resistance.
Prepreg and infusion systems for wind turbine blade root sections and marine structural laminates.
Coating and lining applications for chemical storage tanks and industrial flooring under aggressive service conditions.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gel particles and sediment |
| Epoxy Equivalent Weight (EEW) | 185–195 g/eq |
| Viscosity (25°C) | 4,500–5,500 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | ≥ 12 months at ≤ 25°C in sealed original containers |
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E-mail: wangxingqiang@ericwchem.com
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