High purity bisphenol-A based liquid epoxy resin with consistent molecular weight distribution.
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity (10,000–12,000 cP at 25°C) enabling easy processing, mixing, and impregnation.
Superior electrical insulation properties and thermal stability up to 130°C continuous service temperature.
Low chloride content (< 500 ppm), ensuring high reliability in electronic encapsulation and potting applications.
Electrical and electronic encapsulants for transformers, sensors, and power modules.
Potting compounds for automotive control units and EV battery management systems.
High-performance laminating resins for printed circuit board (PCB) prepregs and copper-clad laminates.
Structural adhesives requiring thermal cycling resistance and low outgassing in aerospace assemblies.
Insulating varnishes for motor and generator windings in industrial and renewable energy equipment.
| Chemical Type | Bisphenol-A diglycidyl ether (DGEBA) |
| Product Form | Clear, pale yellow liquid |
| Appearance | Transparent, slightly viscous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 10,000–12,000 cP |
| Chloride Content | < 500 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at 20–25°C in original sealed container |
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E-mail: wangxingqiang@ericwchem.com
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