High reactivity with amine and anhydride hardeners for rapid cure at ambient or elevated temperatures.
Excellent adhesion to metals, composites, and engineered plastics without surface pretreatment.
Low viscosity (350–450 mPa·s at 25°C) enabling easy processing, impregnation, and void-free casting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to weak acids, alkalis, and aliphatic solvents after full cure.
Electrical encapsulation of transformers, reactors, and high-voltage insulators.
Structural bonding in aerospace composite assemblies and metal-to-composite joints.
Matrix resin for filament-wound pressure vessels and carbon fiber reinforced components.
Underfill and potting material for power electronics modules and IGBT packaging.
High-performance coating systems for corrosion protection in marine and offshore equipment.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Water-white to pale yellow, transparent |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 350–450 mPa·s |
| Chloride Content | ≤ 750 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Storage Stability | 12 months at ≤ 25°C in sealed original container |
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E-mail: wangxingqiang@ericwchem.com
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