Low viscosity for excellent processability and easy handling in casting, coating, and impregnation applications.
High reactivity with amine and anhydride curing agents, enabling rapid gelation and short cycle times.
Superior chemical resistance—especially to alkalis and solvents—compared to standard Bisphenol A epoxy resins.
Enhanced flexibility and impact resistance due to the flexible methylene bridge structure of Bisphenol F backbone.
Low chlorine content (< 500 ppm), supporting compliance with stringent electrical and electronic industry requirements.
Electrical encapsulation and potting compounds for transformers, sensors, and power modules.
High-performance protective coatings for marine, offshore, and industrial infrastructure.
Structural adhesives requiring thermal stability and moisture resistance.
Fiberglass-reinforced composites used in corrosion-resistant tanks and piping systems.
UV-curable hybrid formulations where low viscosity and high functionality are critical.
| Chemical Type | Bisphenol F-based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxy Equivalent Weight (EEW) | 165–175 g/eq |
| Viscosity at 25°C | 12,000–16,000 mPa·s |
| Chlorine Content | ≤ 500 ppm |
| Volatiles | ≤ 0.3 wt% |
| Softening Point | Not applicable (liquid at room temperature) |
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