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High purity bisphenol A-based epoxy resin with consistent molecular weight distribution.
Excellent thermal stability and low volatility, suitable for high-temperature curing processes.
Low chlorine content (< 800 ppm), ensuring superior electrical insulation and corrosion resistance.
Good compatibility with common amine and anhydride hardeners for versatile formulation flexibility.
Optimized viscosity (12,000–15,000 cP at 25°C) for efficient processing in coating, adhesive, and composite applications.
Electrical laminates for printed circuit boards (PCBs) requiring high dielectric strength.
Structural adhesives in aerospace and automotive bonding assemblies.
High-performance protective coatings for marine and industrial steel structures.
Matrix resin for fiber-reinforced composites in wind turbine blades and sporting goods.
Potting and encapsulation compounds for electronic components and power modules.
| Chemical Type | Bisphenol A epoxy resin (diglycidyl ether) |
| Product Form | Amber to light yellow viscous liquid |
| Appearance | Clear, homogeneous liquid without sediment or haze |
| Epoxy Equivalent Weight (EEW) | 187–193 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Gardner Color | ≤ 3 |
| Volatiles (150°C, 2 h) | ≤ 0.3 wt% |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
