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Highly reactive liquid bisphenol-A epoxy resin with excellent compatibility with standard amine and anhydride curing agents.
Low viscosity (12,000–14,000 cP at 25°C) enabling easy processing, impregnation, and flow control in casting and laminating applications.
Superior thermal stability and chemical resistance post-cure, particularly against alkalis and solvents.
Consistent batch-to-batch quality with tightly controlled epoxide equivalent weight (EEW: 185–192 g/eq).
Low volatile organic compound (VOC) content, supporting compliance with industrial environmental and safety standards.
Electrical insulation systems for transformers, reactors, and high-voltage bushings.
Structural adhesives requiring high bond strength and temperature resistance.
Casting and encapsulation of electronic components and power modules.
Laminating resin for glass fiber-reinforced composites in industrial tooling and marine parts.
Formulation base for high-performance coatings used in corrosion-resistant tank linings and pipe coatings.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Transparent, slightly yellow, homogeneous liquid |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–14,000 cP |
| Chlorine Content (Total Cl) | ≤ 700 ppm |
| Softening Point | 12–16°C |
| Density (25°C) | 1.16–1.18 g/cm³ |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
