High reactivity with amine and anhydride hardeners for rapid gelation and efficient curing.
Excellent adhesion to metals, composites, and cured epoxy substrates.
Low viscosity (12,000–15,000 cP at 25°C) enabling easy processing and improved filler wetting.
Superior electrical insulation properties with high dielectric strength and volume resistivity.
Good chemical resistance to alkalis, aliphatic solvents, and mild acids after full cure.
Electrical encapsulation and potting of transformers, reactors, and high-voltage insulators.
Structural adhesive formulations for aerospace and automotive composite bonding.
Matrix resin in filament-wound pressure vessels and carbon fiber reinforced components.
Coating systems for corrosion protection of offshore platform steel structures.
High-performance laminating resin for printed circuit board (PCB) prepregs and base materials.
| Chemical Type | Bisphenol-A based liquid epoxy resin |
| Product Form | Clear to pale yellow viscous liquid |
| Appearance | Homogeneous, transparent, free from gels or sediment |
| Epoxy Equivalent Weight (EEW) | 184–190 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Volatiles Content | ≤ 0.3 wt% |
| Storage Stability | 12 months at ≤ 25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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