High-performance bisphenol-A based liquid epoxy resin with excellent reactivity toward amine and anhydride curing agents.
Low viscosity for improved wetting, ease of processing, and enhanced filler incorporation in composite formulations.
Superior electrical insulation properties and thermal stability suitable for demanding electronic encapsulation applications.
Consistent batch-to-batch quality and strict control of chloride content to ensure reliability in high-purity applications.
Compatible with standard epoxy hardeners and modifiers for flexible formulation development across industrial segments.
Electrical and electronic encapsulants for transformers, reactors, and power modules.
Insulating varnishes and impregnating resins for motor and generator windings.
Structural adhesives requiring high bond strength and environmental resistance.
Composite matrix resin for fiber-reinforced laminates in aerospace and transportation components.
High-voltage insulators and castings for utility and renewable energy infrastructure.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow low-viscosity liquid |
| Appearance | Transparent, homogeneous liquid at 25°C |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–16,000 mPa·s |
| Chloride Content | ≤ 700 ppm |
| Softening Point | Not applicable (liquid at room temperature) |
| Primary Applications | Encapsulation, impregnation, adhesive, and composite matrix |
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E-mail: wangxingqiang@ericwchem.com
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