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High reactivity with epoxy resins, enabling rapid gelation and reduced cure time at ambient or moderate temperatures.
Excellent chemical resistance—particularly to alkalis, solvents, and corrosive environments—after full cure.
Superior mechanical properties in cured systems, including high tensile strength, hardness, and dimensional stability.
Low viscosity and good compatibility with standard bisphenol-A and bisphenol-F epoxy resins.
Provides enhanced thermal stability with glass transition temperatures (Tg) typically exceeding 120 °C in formulated systems.
High-performance protective coatings for industrial steel structures and marine infrastructure.
Electrical encapsulation and potting compounds for transformers, sensors, and power electronics.
Structural adhesives requiring fast development of handling strength and long-term durability.
Composite matrix resins for aerospace and wind energy components demanding low exotherm and high Tg.
Chemical-resistant flooring and grouting systems in pharmaceutical and food-processing facilities.
| Chemical Type | Isophoronediamine (IPDA), aliphatic diamine |
| Product Form | Liquid |
| Appearance | Colorless to pale yellow clear liquid |
| Amine Value | 450–470 mg KOH/g |
| Viscosity (25 °C) | 80–120 mPa·s |
| Refractive Index (20 °C) | 1.475–1.485 |
| Density (25 °C) | 0.92–0.94 g/cm³ |
| Primary Applications | Epoxy resin curing agent for coatings, adhesives, composites, and encapsulants |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
