High-purity bisphenol-A based liquid epoxy resin with low chlorine content.
Excellent compatibility with common amine and anhydride curing agents.
Good thermal stability and low viscosity for enhanced processability in casting and impregnation.
Superior electrical insulation properties suitable for electronic encapsulation.
Consistent batch-to-batch performance meeting ISO 9001 manufacturing standards.
Electrical insulation systems for transformers and reactors.
Encapsulation and potting of power electronics and LED modules.
Structural adhesives for aerospace and automotive composite bonding.
High-voltage insulators and bushings requiring dielectric reliability.
Wind turbine blade bonding and repair formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear to pale yellow liquid |
| Appearance | Homogeneous, transparent, free of gel or sediment |
| Epoxy Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chlorine Content | ≤ 800 ppm |
| Color (Gardner) | ≤ 2 |
| Softening Point | Not applicable (liquid at room temperature) |
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E-mail: wangxingqiang@ericwchem.com
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