High-purity bisphenol-A based liquid epoxy resin with consistent epoxide equivalent weight (EEW).
Excellent compatibility with standard amine and anhydride curing agents for broad formulation flexibility.
Low viscosity at room temperature, enabling easy handling, mixing, and impregnation in composite processes.
Superior electrical insulation properties and low dielectric loss, suitable for high-reliability electronic encapsulation.
Good thermal stability and adhesion to metals, glass, and reinforced substrates after cure.
Electrical and electronic encapsulants for transformers, sensors, and PCB potting.
Structural adhesives for aerospace and automotive bonding applications.
Matrix resin in fiber-reinforced composites (e.g., carbon/glass fiber laminates).
Coating systems for corrosion-resistant industrial linings and tank protection.
Wind turbine blade adhesive and gel coat formulations.
| Chemical Type | Bisphenol-A epoxy resin |
| Product Form | Clear, low-viscosity liquid |
| Appearance | Pale yellow to water-white, transparent |
| Epoxide Equivalent Weight (EEW) | 185–192 g/eq |
| Viscosity (25°C) | 12,000–15,000 cP |
| Chloride Content | ≤ 500 ppm |
| Softening Point | 12–16°C |
| Storage Stability | ≥ 12 months at <25°C in sealed containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China